By preventing freezing at extreme cold temperatures, the acetone-based cooling solution protects not only the thermal transfer system but also the Computer-on-Module (COM), reducing the risk of damage and system failures. This enables the use of COMs in environments that previously required complex and costly custom solutions. The new cooling system supports applications operating between -40 °C and +85 °C (-40 °F to +185 °F).
Expanding the Possibilities for COM-Based Systems
The new cooling solution enhances the viability of COM-based designs in demanding environments, including logistics vehicles in ports, airports, and cold storage facilities. It is also suitable for rail, aviation, and other applications where extreme temperatures and mechanical stresses can impact reliability.Jürgen Jungbauer, Senior Product Line Manager at congatec, stated:
“Our new acetone-based cooling solution extends module-based designs to include applications under extreme operating conditions that could not previously be achieved with conventional cooling solutions. Using our application-ready COMs instead of expensive slot or special solutions allows developers to optimize time-to-market while reducing development effort and the overall costs of their applications.”
Compatibility and Availability
The acetone-based heat pipe cooling solution is particularly effective when paired with congatec’s COM Express Type 6 conga-TC675 or its ruggedized counterpart conga-TC675r. It is also compatible with COM-HPC Mini, Client, and Server form factors, offering robust cooling for edge servers. The solution will be available in various configurations, including a heat pipe adapter.Congatec continues to focus on high-performance cooling solutions as part of its broader COM ecosystem, which includes carrier boards and development services. Jungbauer concluded:
“We have always placed the greatest value on high-performance cooling for reliable computing. Our acetone-based cooling solution once again demonstrates our technological leadership in high-performance Computer-on-Module ecosystems.”
This innovation reinforces congatec’s commitment to delivering efficient heat dissipation solutions for extreme environments, optimizing reliability and reducing system costs for embedded and edge computing applications.