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Vertiv CoolChip CDU qualifies as NVIDIA DSX Ready in the US

The 2.3 MW liquid-to-liquid unit supports direct-to-chip and rear-door heat exchanger applications for high-density computing.

Vertiv CoolChip CDU qualifies as NVIDIA DSX Ready in the US

Vertiv has announced that its 2.3 MW Vertiv CoolChip coolant distribution unit (CDU) has qualified as an NVIDIA DSX Ready CDU. The model is the first CDU to qualify specifically as NVIDIA DSX Ready, with Vertiv among the initial providers of qualified CDU solutions in the program.

The 2.3 MW (approx. 7.85 million BTU/h) model is part of Vertiv’s liquid-to-liquid CDU portfolio. It supports direct-to-chip and rear-door heat exchanger applications and is designed for installation at the end of a row or along the room perimeter. A CDU manages the flow and temperature of liquid used to remove heat from high-density computing systems.

The NVIDIA DSX AI Factory Platform integrates AI factory design and operations across compute, networking, power, cooling, facilities and software. NVIDIA DSX Ready connects specific products with applicable NVIDIA DSX requirements. For CDU providers, qualification uses the NVIDIA CDU self-qualification suite to determine whether a specific product meets applicable functional requirements.

Vertiv said qualification does not replace engineering for individual sites or configurations. Customers must still determine how a qualified product fits their facility design, system configuration and operating requirements.

“The scale of AI deployment is forcing a more integrated approach to data center infrastructure,” said Scott Armul, Chief Product and Technology Officer of Vertiv. “Compute, power and cooling decisions can no longer be made independently. A constraint on any one of those systems can limit the performance and productive capacity of the entire facility. NVIDIA DSX Ready gives customers a more consistent basis for evaluating critical infrastructure within that larger design.”

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