BITZER is presenting new compressor technologies and cooling solutions at Chillventa 2026 in Nuremberg, Germany, focusing on data center cooling, large-scale heat pumps and natural refrigerants. At Hall 1, Stand 303, the company is showcasing products designed to address changing HVACR requirements driven by artificial intelligence, decarbonisation and regulatory developments.
For data center cooling, BITZER is introducing the HELICOM CS60 screw compressor series, supporting cooling systems for AI chips with supply temperatures of up to +45°C (113°F). The series supports established low-GWP refrigerants, full- and part-load operation, and low-lift operation at low ambient temperatures. Optimised rotor profiles and an integrated IQ MODULE support efficiency and operational reliability.
In large-scale heat pumps, BITZER is highlighting its CSH2T compact screw compressors, developed for high-temperature applications. The series enables fluid outlet temperatures of up to +120°C (248°F) and heating capacities of approximately 1.1 MW (3.75 million BTU/h) per compressor. Applications include industrial heating processes and district heating networks. BITZER is also working to extend its heat pump component application range to condensing temperatures above +140°C (284°F).
BITZER is expanding its natural refrigerant portfolio with new 6-cylinder ECOLINE CO2 reciprocating compressors for transcritical applications, extending the range to 2- through 8-cylinder models. The new ECOLITE CO2 air-cooled condensing units target medium- and low-temperature applications with a plug-and-play concept. The ORBIT PRO scroll compressor series adds propane versions optimised for heat pumps, air conditioning, process cooling and IT cooling.
For industrial ammonia refrigeration, BITZER is presenting the ACP SINGLE solution, based on the OS.A95 screw compressor. The single-compressor unit supports flexible and redundant system configurations. The company is also introducing the BITZER Arena, demonstrating how its products, digital tools, technical expertise and services interact throughout the product life cycle.
“With HELICOM, we are presenting one of the most significant developments in our screw compressor technology,” said Rainer Große-Kracht, Vice-Chairman of the Management Board and Chief Technology Officer at BITZER. “The new series supports cooling systems for the latest generation of AI chips with supply temperatures of up to +45°C and enables standardised cooling platforms that can be deployed consistently around the world. HELICOM is built on more than four decades of BITZER experience in screw compressor technology.”
