Advanced Cooling Technologies, Inc. (ACT) announced that it has been selected to receive $1.1 million in funding through two subcontracts from the U.S. Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E). The funding is part of the COOLERCHIPS program, which aims to develop high-performance, energy-efficient cooling solutions for data centers.
The funding underscores ACT’s expertise in next-generation cooling technologies, said Dr. William Anderson, Chief Engineer of ACT. The new technologies aim to enhance rack power density, improve system reliability, reduce power consumption, and minimize carbon footprints, positioning the U.S. as a leader in data center cooling.
ACT will collaborate with Intel and Purdue University on the "Enabling Two-Phase Immersion Cooling to Support High Thermal Design Power (TDP)" project. This initiative focuses on developing novel heat sinks through Topology Optimization (TO) to support high-power server devices. ACT will fabricate prototypes and test their performance over three years, targeting a total thermal resistance from chip to coolant of less than 0.01 kW for data center server powers of 10-100 kW.
In the second subcontract, ACT partners with the University of Missouri to develop the "Dual-Mode Hybrid Two-Phase Loop for Data Center Cooling" technology. This scalable cooling solution offers several advantages over existing phase-change processes, and ACT will assist in hardware development and testing for loads up to 10 kW.
These projects are set to advance data center cooling technologies, promoting energy efficiency and sustainability.
