Flex and LG Electronics have announced a partnership to co-develop integrated cooling systems for high-density AI data centers, combining their respective portfolios of liquid and air-based thermal management technologies.
The collaboration aims to address the increasing power and heat demands of large-scale data centers. Flex will contribute its liquid cooling systems, power products, and IT infrastructure, while LG will provide air and liquid cooling technologies such as CRAC, CRAH units, chillers, coolant distribution units (CDUs), and related monitoring solutions.
Jointly developed modular systems will form part of the Flex AI infrastructure platform, which integrates power, cooling, and compute capabilities. The prefabricated solutions are designed to simplify deployment and support the scalability needed for AI workloads.
LG's chiller systems will operate alongside Flex and LG CDUs and secondary fluid networks (SFNs), maintaining separation between facility and IT cooling fluids. The integrated systems aim to improve temperature control, enhance energy efficiency, and support rapid scaling for AI compute environments.
“Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center,” said Michael Hartung, president and chief commercial officer at Flex.
James Lee, president of the LG ES Company, added: “Our collaboration with Flex adds new momentum to our global expansion and enhances our ability to deliver unique value to clients worldwide.”