Webinar: Direct Chip Level Cooling: CAPEX & OPEX Evaluations for Legacy Data Centers, Repurposed for Edge Deployments
When: March 31, 2020 at 1:00 PM EDT
Where: Virtual Conference - Sign up with DCD today!
With the virtualization of applications driving up average density per rack to 15-16kW, it is difficult to forecast how the industry's standard cooling practices will withstand the pressure of next-generation workloads. Attend this session to gain insight into the cooling methods best able to manage the future trajectory of data center compute.
Speakers
Joerg Desler is President of STULZ Air Technology Systems, Inc. based in Frederick, Maryland, the US arm of STULZ, the global manufacturer of precision air conditioning, humidification and dehumidification systems. Joerg started with STULZ GmbH in 1992 and relocated to the US in 2001 where he was responsible for manufacturing, engineering as well as R&D before moving into his current role. Joerg holds an Electrical Engineering degree from the University of Applied Sciences in Hamburg, Germany and is a member of APICS and ASHRAE.
David C. Meadows II has worked in data center cooling since 1999. He is currently the Director of Technology at STULZ USA, a manufacturer of precision air conditioning, humidification, and dehumidification products specifically designed for the data center. Previously David has served as both the Design Engineering Manager and the Applications Engineering Manager at Stulz. David holds a Bachelor of Science degree in Mechanical Engineering from the University of Maryland Baltimore County. David is also a graduate of the United States Navy Nuclear Power School.