Midea Launches AI Data Center Cooling Solutions in Malaysia

The full-stack offering combines liquid cooling, air-fluid coordination and digital O&M for high-density AI infrastructure.

Midea Launches AI Data Center Cooling Solutions in Malaysia

Midea Building Technologies launched its data center thermal management solution for AIDC infrastructure in overseas markets at its “Feel the Future” event in Malaysia. The solution targets slow deployment, energy efficiency concerns and high total cost of ownership in data centers supporting AI infrastructure.

The company said customer demand is shifting from individual equipment to full-stack capabilities covering consulting, design, delivery and maintenance. MBT’s data center thermal solution covers consulting, planning and design, equipment selection, product delivery and post-operation maintenance for high-density computing scenarios.

MBT has developed a liquid-cooling technology matrix covering cooling sources, CDUs, liquid-cooling terminals and digital O&M. It also proposed an “air-fluid synergy” architecture designed to coordinate room air cooling and server liquid cooling.

The product portfolio includes a maglev active CDU that integrates a magnetic bearing cooling source and distribution unit, reducing floor space by more than 50%. Under tropical climate conditions, the product helps achieve a system PUE below 1.2. MBT also presented a next-generation air-cooled magnetic bearing chiller for water-scarce and high-temperature environments, and an industrial-grade CDU with 2,600 kW cooling capacity at 3K ΔT.

Midea also said it broke ground in March on a liquid-cooling smart manufacturing base in Shunde with a total investment of more than RMB 1 billion [approx. USD 139 million]. The base will support mass production of core products including free-cooling magnetic bearing chillers and CDUs, and is expected to be completed and put into operation in August 2027.

The event included presentations from National University of Singapore experts on the Sustainable Tropical Data Centre Testbed and chip-level cooling technologies. During a panel discussion, experts said thermal design is becoming a core part of architecture, especially in tropical regions, and that future metrics should go beyond PUE to include compute efficiency and total cost of ownership.

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