KAORI Thermal Technology presented its latest liquid cooling solutions compatible with GB200, GB300, and ORV3 architectures at COMPUTEX 2025, held from May 20–23 at Taipei Nangang Exhibition Center. The company targeted growing thermal management needs driven by the expansion of AI servers and high-performance computing (HPC).
KAORI’s showcased systems included Rear Door Air-to-Liquid Heat Exchangers, Side Car modules, Direct-to-Chip (D2C) In-Rack CDU systems, high-capacity In-Row CDU units, and Immersion Cooling Systems. All were designed for full compatibility with GB200 and ORV3 rack infrastructures. The company also introduced MGX Liquid Manifolds, Hose Assemblies, and Brazed Plate Heat Exchangers, aiming to support global OEMs with scalable production and deployment.
The company highlighted its in-house development and Taiwan-based manufacturing of Brazed Plate Heat Exchangers, which are CE and UL certified. These exchangers featured customizable designs and advanced internal channel configurations, manufactured using high-vacuum brazing. KAORI positioned these components as preferred solutions for major server brands.
KAORI emphasized the modularity and integration of its liquid cooling systems, stating that the designs supported rapid deployment and flexible replacement across data center environments.
“As computing density and power consumption of AI servers surge, thermal design is rapidly shifting toward the liquid cooling era. KAORI Thermal Technology offers liquid cooling solutions that feature rapid deployment, modular integration, and multiple international certifications—delivering highly reliable and efficient thermal management for data centers,” said the company.
