Nidec Corporation has announced the development of the NIR3.0, an In-Row Coolant Distribution Unit (CDU) prototype with a maximum cooling capacity of 3.2 MW (approx. 10.9 million BTU/h) and support for 800 VDC power input. The unit is being showcased at Booth E63 during the OCP Global Summit 2026, held October 12–15, as part of Nidec’s liquid cooling solutions for high-density AI data centers.
The NIR3.0 offers the highest cooling capacity in Nidec’s liquid cooling lineup. Designed for large-scale AI clusters, the system addresses increasing heat loads associated with advanced generative AI workloads and high-density server installations.
The unit supports 800 VDC high-voltage direct current input, which Nidec says reduces power conversion and transmission losses compared with conventional AC or lower-voltage DC systems. According to the company, this capability can help data center operators improve Power Usage Effectiveness (PUE) and reduce operating expenses.
Nidec is presenting the NIR3.0 alongside peripheral liquid cooling components as part of an end-to-end thermal management solution. The company aims to begin mass production in the first half of 2027, incorporating feedback from industry partners and summit attendees to support next-generation AI semiconductors with high heat loads.
