Trane Technologies and Eaton have announced a strategic collaboration integrating thermal management and electrical system architectures for AI data centers. The companies introduced a reference design aligned with NVIDIA DSX platforms that combines power and cooling systems to accelerate deployment and reduce costs.
The companies said their medium-voltage approach for higher-power-density AI factories can deliver combined energy efficiency gains of up to 15%, reduce copper use by as much as 80% and cut installation costs by up to 30% compared with conventional low-voltage designs.
The reference design is included in the Trane Continuum Rubin DSX and Eaton Beam Rubin DSX platforms. Eaton technology provides power distribution for the Trane platform, while the coordinated architecture enables thermal and electrical power systems from grid to chip to exchange leading indicators and respond dynamically to operating needs.
The design is also built to work with the NVIDIA Omniverse DSX Blueprint for AI data centers. According to the companies, the architecture is designed to evolve as emerging liquid cooling technologies and direct current architectures become mainstream.
“AI and high-performance computing are transforming the demands placed on data centers, and customers want solutions that can keep pace with their needs,” said Mauro J. Atalla, Senior Vice President, Chief Technology and Sustainability Officer, Trane Technologies. “By combining our advanced thermal management solutions with Eaton’s innovative power management solutions, we’re delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future.”
