Valeo will present the validation status of its aluminum heat exchanger technology for data center thermal management with OVH Cloud at the Open Compute Project Global Summit 2026 in California. The technology is designed for rear-door cooling modules of racks or fan walls in data center white space.
According to Valeo, its aluminum solution delivers a 38% increase in cooling capacity and 65% higher power density compared with traditional copper solutions, while reducing fan electrical consumption by 25%. The company says the technology can be used for retrofitting existing racks or for new racks.
Valeo has implemented accelerated long-run testing to assess reliability and aluminum corrosion, while OVH Cloud has conducted tests under real-time conditions for several months. Testing of Valeo’s specific coating has reached the equivalent of more than 10 years of operating life, and Valeo is continuing tests up to 15 years.
The aluminum heat exchanger is part of Valeo’s wider liquid cooling portfolio. This includes Direct-to-Chip systems in single-phase and two-phase configurations for high-density racks, as well as Zero-Water Immersion Units for Micro-Edge compute applications.
“Over the past two years, we have made significant progress in evaluating how aluminum liquid cooling can meet the rigorous reliability and performance standards required by modern high-density facilities,” said Pascale Herman, Data center & BESS Vice President at Valeo. “By combining these early testing metrics with our decades of automotive thermal management expertise, we are working to develop scalable thermal solutions to support the industry’s evolving infrastructure needs responsibly and effectively.”
