UL Solutions has launched a certification program for direct-to-chip liquid cooling subassemblies used in AI data centers and other high-density computing systems. The program evaluates eligible components for safety, performance, leak integrity and interoperability.
Direct-to-chip systems circulate coolant through a cold plate attached to a computer chip, allowing the liquid to absorb and carry away heat. UL Solutions said traditional air cooling may not be sufficient for today’s most powerful computing systems, while liquid cooling can introduce risks including leaks, corrosion, contamination and component compatibility issues.
The certification covers eligible liquid-filled parts and subassemblies that move coolant through information and communication technology equipment. These can include cold plates, manifolds that distribute coolant to servers and equipment racks, and quick disconnects that allow servicing without draining the complete cooling system.
UL Solutions evaluates eligible subassemblies using UL 4501, the Outline of Investigation for Safety, Performance and Interoperability of Liquid-Filled Components and Assemblies Used in Liquid Cooling Systems. Evaluation covers coolant compatibility, pressure and leak integrity, durability, liquid flow, interoperability, production controls and installation requirements.
The company can also evaluate coolant distribution units, self-contained liquid-filled systems, liquid-cooled busways, cables, connectors, power whips, gaskets, O-rings and hoses under applicable UL Standards. Requirements depend on each product’s design, function and intended use.
“AI infrastructure must scale without sacrificing safety or reliability,” said Milan Dotlich, vice president and general manager of Data Center Solutions at UL Solutions. “Independent evaluation of liquid cooling components can help organizations deploy advanced computing systems with greater confidence.”
