Advanced Cooling Technologies, Inc. (ACT), based in Pennsylvania, has demonstrated a high-performance two-phase direct-to-chip liquid cooling solution designed for emerging high-power computing platforms. The system targets next-generation artificial intelligence (AI) and high-performance computing (HPC) architectures.
During recent tests, ACT’s cold plate achieved over 7.5 kW of total power dissipation on a single unit, replicating the thermal demands of advanced "superchip" configurations.
The company reported several technical benchmarks:
Heat flux capability exceeded 300 W/cm² across multiple heat zones
Thermal resistance reached 0.060 °C-cm²/W while operating at less than 0.8 LPM/kW
Surface temperatures remained under 70 °C with an inlet coolant temperature of 50 °C
“These results represent a major milestone in the advancement of two-phase direct-to-chip cooling solutions for next-generation data centers and AI-driven computing systems,” said Devin Pellicone, Head of Data Center Solutions at ACT.