The server liquid cold plate market reached USD 153 million in 2024 and is projected to grow to USD 4,361 million by 2031, at a compound annual growth rate (CAGR) of 62.3%, according to new industry data. Growth is being driven by increasing demand for high-efficiency cooling systems in compact and high-performance server environments, particularly in the Internet and telecom sectors.
Copper+Aluminum cold plates account for 68% of the product type segment. These hybrid solutions are favored for balancing thermal conductivity and cost-efficiency, supporting deployments in data centers where structural optimization and heat dissipation are critical. Pure copper cold plates, while more expensive, are also seeing increased adoption in high-performance computing environments such as AI servers and GPU clusters.
Application-wise, the Internet segment leads with a 40% share, followed by BFSI, telecom, energy, and healthcare. The widespread integration of GPUs in servers and the expansion of high-density computing infrastructure have accelerated demand for direct-to-chip cooling methods, such as liquid cold plates.
North America is experiencing strong adoption due to hyperscale data center growth. Europe’s market is supported by energy efficiency mandates, while the Asia-Pacific region, particularly China and India, is expanding rapidly due to digitalization and cloud infrastructure development.
The top five global manufacturers—AVC, Auras, Cooler Master, CoolIT Systems, and Boyd—hold a combined market share of approximately 96%. Other notable companies include Shenzhen Cotran New Material, Shenzhen FRD, Nidec, Forcecon, and KENMEC.