DDC Solutions, part of Daikin Applied’s data center portfolio, has expanded its S-Series Rack Containment Platform with two new configurations, the S-5 and GPUVault. The company said the additions are designed for AI, hyperscale and HPC environments, extending the platform to higher-density compute tiers while combining rack containment, direct-to-chip liquid cooling, and facility HVAC and chiller technologies.
The S-Series encloses each rack in a sealed, controlled environment intended to protect GPU assets from fire, water, dust and environmental intrusion while optimizing airflow and pressure control. According to DDC, all S-Series configurations provide NEMA 3R-grade environmental protection and support ultra-high-density airside cooling with optional 1 MW+ direct-to-chip integration (approx. 3.41 million+ BTU/h).
DDC said the S-4 remains its standard row solution for 24-31.5 inch (600-800 mm) racks. It provides up to 85 kW of airside cooling per rack (approx. 290,000 BTU/h) and is designed to support future direct-to-chip deployment for higher-density roadmaps.
The new S-5 uses a 42-inch-wide (approx. 1,067 mm), 96-inch-deep (approx. 2,438 mm) enclosure for next-generation GPU clusters. DDC said it supports up to 100 kW of airside cooling per rack (approx. 341,000 BTU/h), with optional liquid-to-chip coolant paths, compatibility with Daikin/Chilldyne CDU systems, support for in-rack and in-row CDU architectures, Dynamic Density Control for airflow and pressure optimization, and an integrated electrical demarcation feature. GPUVault is aimed at retrofit sites with ceiling-height or MEP constraints and includes a three-cabinet module with a central air-handling unit, support for 36-inch (approx. 914 mm) and 42-inch (approx. 1,067 mm) cabinets, a side-car water loop design, and up to 200 kW of airside cooling (approx. 682,000 BTU/h).
The expanded platform is also compatible with CDU systems including solutions from Chilldyne, which Daikin Applied recently acquired. Daikin Applied said the launch complements its investment in thermal management technologies, including a $163 million R&D test lab under construction in Plymouth, Minnesota, for testing rack containment, liquid cooling and integrated thermal solutions.
“Emerging high-density compute platforms are fundamentally changing the power, thermal, and risk dynamics of today’s data halls,” said Keith Markley, CEO of DDC Solutions. “The expanded S-Series provides operators with a unified architecture to safeguard multi-million-dollar GPU investments, achieve higher densities, and grow within existing facilities without increasing risk.”
