Vertiv, a leader in critical digital infrastructure solutions, expands its liquid cooling offerings with the introduction of two new Vertiv™ CoolChip CDU systems. Designed for data centers, these coolant distribution units enable cost-effective liquid cooling for high-density AI computing alongside traditional air-cooled setups. The new systems are showcased at SC24, the supercomputing conference from November 19 - 22.
The Vertiv CoolChip CDU line offers data centers flexibility for scalable growth, supporting multiple high-density racks from one CDU to accommodate AI demands. Vertiv's service offerings encompass solution design, installation, and ongoing lifecycle management.
"The AI-focused data center requires advanced cooling," said John Niemann, SVP of Thermal at Vertiv. "Our expanded liquid-cooled solutions allow seamless integration of liquid cooling into hybrid setups, making AI deployments efficient and cost-effective."
The Vertiv CoolChip CDU 2300kW offers 2.3 MW of cooling, ideal for large-scale hyperscale deployments with the smallest footprint per capacity range, suitable for in-row or external installations.
Meanwhile, the Vertiv CoolChip CDU 350kW supports direct-to-chip liquid cooling with air-based heat rejection, enabling retrofits without a chilled water system.
Both systems can directly distribute coolant and cater to varying demands with smart controls and remote monitoring features, enhancing efficiency and adaptability in data center cooling strategies.
