Vertiv has expanded its liquid cooling portfolio in Europe, the Middle East and Africa (EMEA) with the launch of the Vertiv CoolChip CDU 70, CDU 100 and CDU 600. These new coolant distribution units (CDUs) are designed for high-density applications in artificial intelligence (AI) and high-performance computing (HPC) environments. The CoolChip CDU 600 is being showcased at the Datacloud Global Congress in Cannes this week.
The CoolChip CDU family supports direct-to-chip (DTC) liquid cooling and includes both in-rack and row-based models with liquid-to-air and liquid-to-liquid configurations. These units are intended for retrofitting existing data centres or deploying in new greenfield sites.
The Vertiv CoolChip CDU 70 is a liquid-to-air, in-row unit with up to 70 kW of cooling capacity. It is designed to work with existing thermal infrastructure and reduce fluid network complexity. It features an integrated controller for real-time monitoring and coordinated thermal management across racks.
The CDU 100 is an in-rack, liquid-to-liquid system offering 100 kW of cooling in a 4U form factor. It includes a large-surface heat exchanger, built-in filtration, and temperature control within ±1°C. It separates facility and IT loops for operational security in mission-critical settings.
The CDU 600 is an in-row, liquid-to-liquid model providing 600 kW of cooling capacity. Designed for hyperscale and colocation environments, it features redundant pumps, temperature and fluid monitoring, and flexible deployment with top or bottom piping and optional internal manifolds.
“The Vertiv CoolChip CDU family offers flexible, scalable solutions that simplify deployment and support long-term growth,” said Sam Bainborough, vice president, EMEA thermal business at Vertiv. “By reducing integration complexity and adapting to a range of data centre environments, these CDUs help organisations scale liquid cooling more efficiently.”