Vertiv has introduced new configurations of its MegaMod HDX modular cooling and power infrastructure, designed to support high-density compute environments across North America and EMEA. The solution targets applications such as artificial intelligence (AI) and high-performance computing (HPC), offering rack densities from 50 kW to over 100 kW per rack.
The Vertiv MegaMod HDX combines direct-to-chip liquid cooling with air-cooled systems in a hybrid architecture. The compact model supports up to 13 racks with a power capacity of 1.25 MW, while the extended-height combo model accommodates up to 144 racks and delivers up to 10 MW. Both configurations use a prefabricated modular design to accelerate deployment and enable scalable data center growth.
The solution includes distributed redundant power architecture to ensure continuous operation even if a module fails, and a buffer-tank thermal backup system for GPU cluster stability during maintenance or load shifts. Factory integration and testing aim to streamline installation and provide cost certainty for planning.
The MegaMod HDX incorporates components from Vertiv’s broader portfolio, such as the Vertiv Liebert APM2 UPS, Vertiv CoolChip CDU, and Vertiv PowerBar busway system. It also supports compatible IT rack infrastructure including OCP-compliant racks, rear door heat exchangers, and in-rack power and cooling systems.
“Today’s AI workloads demand cooling solutions that go beyond traditional approaches,” said Viktor Petik, senior vice president, infrastructure solutions at Vertiv. “Our designs deliver what data centres need most – reliable performance, operational efficiency, and the ability to scale their AI infrastructure with confidence.”
