TICA has presented an integrated portfolio of data center cooling products designed to provide thermal management from the cooling source to the IT rack. The portfolio covers primary-side cooling sources, secondary-side precision cooling and liquid cooling for high-density AI infrastructure.
The company’s self-developed product portfolio supports integrated air-liquid cooling and multi-mode liquid cooling architectures. TICA also offers customized solutions for different application scenarios as computing loads become increasingly dense.
TICA’s data center solution model combines these technologies into a complete thermal management system, with solutions designed to support next-generation platforms including GB300-class AI computing. For Southeast Asian operating conditions, the systems address high ambient temperatures and humidity, while targeting performance, scalability, energy efficiency and water-conscious operation.
According to TICA, its air-liquid integrated cooling solutions have been applied in more than 100 large-scale data center projects. The company has delivered more than 12,000 fan walls and 10,000 high-performance chillers globally, serving customers including Amazon, Alibaba and TikTok.
TICA showcased the portfolio at ENGINEER & MARVEX 2026, held in Kuala Lumpur, Malaysia, from September 22–25.
