Carrier has introduced a new Coolant Distribution Unit (CDU) as part of its QuantumLeap portfolio, designed to support large-scale, direct-to-chip liquid cooling in data centers. The solution is aimed at improving energy efficiency and simplifying thermal management across hyperscaler and colocation environments.
The CDU product family includes unit sizes from 1.3 to 5 MW, supporting a range of high-density cooling applications. The system is engineered with fewer mechanical and electrical components to maximize uptime, reduce installation complexity, and simplify maintenance. Carrier states that the CDU enables efficient chip-level cooling, low pressure drops, and improved chiller performance, helping to lower power usage effectiveness (PUE).
The modular heat exchangers in the Carrier CDU are capable of achieving approach temperatures as low as 3.6°F (2°C), compared to the more common 7.2°F (4°C), allowing up to 15% chiller energy savings. Units can be deployed in-row or in mechanical galleries and offer three-side access and a shallow cabinet design for serviceability in confined spaces. Configuration options include various electrical arrangements, mechanical redundancy, and adjustable controls for precise coolant flow.
The CDU integrates with other Carrier QuantumLeap solutions, including Automated Logic building controls, Nlyte infrastructure management software, custom air handling units, and chiller systems with magnetic bearing compressors. According to Carrier, data center operators can reduce non-IT energy use by up to 50% compared to legacy cooling systems.
“The Carrier CDU builds on Carrier’s history of innovation, our focus on customer needs and our available global scale to further expand our data center offerings to help ensure real-time optimization, adaptability and efficiency across data center operations,” said Christian Senu, Executive Director, Data Centers, Carrier.
