Vertiv has introduced the Vertiv CoolLoop Trim Cooler, an energy-efficient and space-saving cooling solution designed for AI and high-performance computing (HPC) applications. The system operates effectively with fluctuating water temperatures, making it suitable for hybrid-cooled or liquid-cooled data centers and AI factories in diverse climate conditions.
The CoolLoop Trim Cooler is engineered to integrate seamlessly into high-density, liquid-cooled environments. It reduces annual cooling energy consumption by up to 70% through free-cooling and mechanical operation and provides 40% space savings compared to traditional systems. The solution is designed to handle supply water temperatures up to 40°C and supports cold plate functionality at 45°C, addressing the cooling challenges of modern AI factories.
The system simplifies integration with direct water connections, allowing easy pairing with Vertiv CoolChip CDU coolant distribution units for direct-to-chip cooling or direct connection to immersion cooling systems. This adaptability helps minimize installation complexity, reduces operational costs, and enhances compatibility across different high-density cooling environments.
“AI is dramatically changing the cooling profiles of today’s data centres, requiring innovative approaches to managing the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president, thermal business EMEA at Vertiv. “Today’s announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver pioneering, future-ready liquid cooling and chilled water solutions to meet our customers’ AI-driven demands.”
The Vertiv CoolLoop Trim Cooler uses a low-GWP refrigerant and offers a scalable cooling capacity of up to nearly 3 MW in air-cooled configurations. Designed for free cooling in high ambient temperatures, it reduces electricity consumption and CO₂e emissions. The system is also compliant with the 2027 EU F-GAS regulations ban, eliminating the need for costly redesigns or infrastructure upgrades.