LG Electronics has qualified its 2.6-megawatt (MW) Coolant Distribution Unit (CDU) as an NVIDIA DSX Ready CDU. The unit meets applicable NVIDIA DSX reference design requirements for AI factory infrastructure and is listed on the NVIDIA DSX AI Factory Marketplace.
The qualification follows infrastructure qualification of LG’s 600-kilowatt (kW) and 1 MW CDU models. The 2.6 MW model met additional requirements to become DSX Ready and is categorized by NVIDIA as a “Large-Scale” solution.
The CDU is a component of direct-to-chip (DTC) liquid cooling systems. It circulates coolant through cold plates to remove heat from CPUs and GPUs and transfers that heat to the data center cooling infrastructure. LG designed the 2.6 MW unit to manage thermal loads generated by large-scale AI server clusters.
The CDU forms part of LG’s “Chip-to-Chiller” portfolio, which also includes high-efficiency chillers and Computer Room Air Handlers (CRAHs). According to TrendForce figures cited by LG, liquid cooling penetration for AI chips is expected to increase from 14 percent in 2024 to approximately 60 percent by 2027.
“NVIDIA’s qualification of our 2.6MW CDU for AI factory infrastructure reinforces our position as a first mover in the next-generation liquid cooling market,” said James Lee, president of the LG Eco Solution Company. “We will continue to supply AI data center operators with highly reliable, in-house developed cooling solutions from our comprehensive Chip-to-Chiller portfolio.”
