LG Electronics and SK Enmove have signed an MOU to jointly develop next-generation refrigerants, refrigeration oils and immersion cooling technologies for applications including AI data centers. The companies signed the agreement on September 21 as they respond to tighter global refrigerant regulations and growing demand for high-efficiency cooling.
A key focus will be the joint development and performance verification of refrigerants with a GWP below 150 that are PFAS-free. According to LG Electronics, the work is intended to meet international environmental regulations and refrigerant-related standards while targeting environmental performance, safety and high cooling performance.
SK Enmove will develop new refrigerant candidates based on its refrigerant development and evaluation experience. LG Electronics will assess their practical application using its experience with HVAC products and systems in global markets.
The companies will also jointly research refrigeration oils tailored to the characteristics of the new refrigerants and HVAC systems. Refrigeration oils help reduce friction and damage between compressors and other key components. The partners plan to develop oils optimized for the new refrigerants, with the aim of improving product performance, efficiency and cost competitiveness.
The agreement also expands the companies’ cooperation on immersion cooling. LG Electronics and SK Enmove plan to build on their existing work for AI data centers and examine potential applications for thermal management of high-heat-generating electrical and electronic equipment, including energy storage systems and electric vehicle components.
“Thermal management technology is a key factor determining energy efficiency and product performance,” said Kim Won-ki, President of SK Enmove. “Through our cooperation with LG Electronics, we will accelerate the development of next-generation refrigerants, refrigeration oils and immersion cooling technologies and expand commercialization opportunities across various industries.”
