LiquidStack has unveiled its new GigaModular CDU, a scalable, modular coolant distribution unit for direct-to-chip liquid cooling, at the Datacloud Global Congress. The system offers up to 10MW of cooling capacity and is designed for modular installation with a pay-as-you-grow approach.
According to LiquidStack, the GigaModular CDU addresses rising thermal management demands driven by AI, cloud computing, and high-density server workloads. The company noted that rack power densities are already surpassing 120kW and are expected to reach 600kW by 2027. The new platform aims to future-proof data center cooling infrastructure in anticipation of next-generation processors such as Nvidia’s B300 and GB300.
The GigaModular CDU supports single-phase direct-to-chip liquid cooling and is available in configurations from 2.5MW to 10MW. Key components include a high-efficiency IE5 pump, dual BPHx heat exchangers, and dual 25µm strainers. The unit’s centralized control module integrates pressure, temperature, and EM flow sensors to optimize system performance.
The CDU is serviceable from the front only, enabling wall-adjacent installation. It can be delivered as a skid-mounted system with rail and overhead piping or as separate cabinets for on-site assembly.
Quoting for the GigaModular CDU will begin in September 2025, with production planned at LiquidStack’s manufacturing site in Carrollton, Texas (USA).
“AI will keep pushing thermal output to new extremes, and data centers need cooling systems that can be easily deployed, managed, and scaled to match heat rejection demands as they rise,” said Joe Capes, CEO of LiquidStack. “With up to 10MW of cooling capacity at N, N+1, or N+2, the GigaModular is a platform like no other.”
