Chemours has introduced its Faizeon two-phase liquid cooling fluid portfolio for high-density data centers and AI computing infrastructure. The fluids are engineered for two-phase direct-to-chip and immersion cooling systems, using phase change to remove heat from processors while supporting reduced cooling-related energy use, water consumption, noise, and equipment footprint.
In an independent third-party test, a two-phase direct-to-chip system using Faizeon 200 fluid operated a GPU at temperatures up to 19°C (34.2°F) lower than a single-phase water-based fluid. The system also required approximately one-third of the coolant flow at the cold plate compared with the water-based solution.
Faizeon fluids use latent heat transfer during phase change to absorb and remove high processor heat loads. According to Chemours, the portfolio combines dielectric performance, boiling heat transfer, materials compatibility, chemical stability, and circular recovery pathways. Multiple fluid operating pressures provide flexibility for different thermal architectures and infrastructure requirements.
The fluids are intended for AI, high-performance computing (HPC), and other high-density computing applications. Chemours states that the solutions can support potential retrofits and new immersion cooling deployments, including warm-water cooling architectures. The company also identifies reduced operating expenses, lower total cost of ownership, and nearly eliminated water consumption among the potential benefits.
The Faizeon portfolio is available globally and draws on more than 90 years of Chemours’ thermal management expertise. The range is designed to offer different combinations of thermal performance and operating pressure across climates and applications.
