SWEP has announced a strategic partnership with Italy-based Microchannel Devices (MCD) that adds printed circuit heat exchangers (PCHE) to SWEP’s existing brazed plate heat exchanger (BPHE) lineup.
Under a buy-resell agreement, SWEP will distribute MCD’s PCHE products through its global sales network. The arrangement gives SWEP customers access to ultra-compact heat transfer solutions via their existing procurement channels with SWEP.
MCD’s printed circuit technology is based on chemical etching and diffusion bonding, with integrated design, production, and testing capabilities. The PCHE format is suited to applications with space constraints, ultra-high working pressures, and extreme temperatures — conditions where brazed plate exchangers may not be the preferred option.
The partnership targets growth in hydrogen infrastructure, energy storage, and CO2 applications. Both companies position the collaboration as a way to serve demanding development requirements in these segments, where PCHE technology offers performance characteristics that complement conventional plate-based designs.
For MCD, the agreement accelerates market access through SWEP’s established global sales channels and customer relationships. For SWEP, it expands the product portfolio without in-house development of the PCHE format.
“This partnership gives SWEP access to complementary products, while MCD benefits from an accelerated market reach through SWEP’s global sales channels and strong relationships,” said Ulrika Nordqvist, SWEP President.
