Vertiv is investing in its Tognana technology campus near Padua, Italy, to expand manufacturing and integrated testing capabilities for data center cooling systems. The company expects the project to double regional chiller production capacity by the end of 2026, supporting demand for AI and high-density computing infrastructure.
Vertiv also plans to complete a large-scale testing laboratory in early 2027. The facility will test large chillers and validate their integration with liquid cooling systems under high-density load conditions and extreme temperature ranges.
According to Vertiv, the expanded testing capability will allow customers to validate thermal performance under expected site conditions. It is also intended to support faster deployment of increasingly complex cooling systems.
The Tognana campus combines research and development, product management, manufacturing, testing and customer engagement. Its Customer Experience Center enables customers and consultants to participate in witness testing of cooling technologies across the thermal chain under real-world operating conditions.
“AI is driving thermal demands that didn’t exist two years ago, with higher densities, faster deployment demands, and no room to compromise on reliability,” said Gio Albertazzi, CEO of Vertiv. “The expansion at Tognana puts us further ahead with more manufacturing capacity, integrated testing, and advanced thermal management systems built for current and future generations of silicon. This investment reinforces our position at the front of the curve.”
