LG Electronics has joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner, expanding its work on thermal management solutions for high-density AI data centers. The company is developing liquid cooling solutions designed to support the power and thermal management requirements of next-generation AI factories.
LG’s 2.6-megawatt (MW) Coolant Distribution Unit (CDU) has qualified as an NVIDIA DSX Ready CDU. According to LG, the 2.6 MW unit has the largest cooling capacity among current DSX Ready CDU partners. The company has also completed NVIDIA infrastructure qualification for its 600 kW and 1 MW CDUs, covering criteria including cooling performance, failover capabilities and reliability.
The CDUs use direct-to-chip (DTC) liquid cooling, delivering coolant directly to CPUs, GPUs and other heat-generating components. They are designed to operate alongside existing air-cooling infrastructure as part of a hybrid cooling system.
LG will showcase its NVIDIA-qualified CDUs at Data Centre World Asia 2026, taking place September 29–30 at Marina Bay Sands in Singapore. The company also plans to pursue NVIDIA qualification for its 4.0 MW CDU model by the end of 2026.
“Joining the NVIDIA Partner Network as a Power and Cooling Preferred Partner is a pivotal step in our strategy to support the expansion of the global AI ecosystem,” said James Lee, president of the LG ES Company. “Together with NVIDIA, LG will help shape the future of AI data centers by delivering advanced cooling solutions that address the industry’s most critical thermal challenges.”
