At Data Center World 2025, LG Electronics introduced its latest data center cooling portfolio, marking its official entry into the U.S. data center market. The company showcased integrated thermal management solutions designed to improve efficiency and reduce downtime in high-density computing environments.
The product lineup featured the Cold Plate for chip-level cooling, offering customizable configurations and machine learning support; the compact Coolant Distribution Unit (CDU) equipped with LG Virtual Sensor technology for predictive maintenance; and the Computer Room Air Handler (CRAH) with LG 3D Blade EC Fans and low static pressure oval coils to optimize airflow and energy use.
Looking ahead, LG announced a strategic partnership with Microsoft to develop advanced cooling systems for AI-driven data centers. The collaboration will leverage LG’s high-efficiency thermal management and chiller technologies to support the growing demands of AI infrastructure. The goal is to co-develop next-generation data centers that offer improved sustainability and operational efficiency.
“By combining LG’s proven HVAC solutions with Microsoft’s data center expertise, we aim to redefine the cooling landscape for AI infrastructure,” said James Lee, Head of LG’s Air Solution Business Unit.
The partnership reflects an industry-wide shift toward specialized cooling approaches as AI workloads continue to grow in scale and intensity.
